We select our memory chips according to our own internally developed techniques to allow later specification and assignment. We build 8-layer boards for DDR2 modules (6-layer boards for DDR1) according to our own enhanced layout. They are equipped with the galvanic hard-gold contacts that are used in industry. Our printed circuit boards are checked for impedance making reflections or interference in signals virtually impossible. Our modules are also equipped with heat-dissipating heat spreaders available in 2 variations depending upon model specifications.

All production processes are carried out on the premises of MSC Vertriebs GmbH in Stutensee near Karlsruhe, Germany where each and every product is tested according to stringent specifications for correct functioning. Each individual module is put to a time-consuming series of tests before being approved for sales.